5thgenerationintelcoreprocessors

2.7Corei(5thgen).2.7.1Broadwell-U;2.7.2Broadwell-H.2.8CoreM(5thgen).2.8.1Broadwell-Y.2.9Corei(6thgen).2.9.1Skylake-U;2.9.2Skylake-H.,Broadwell(previouslyRockwell)isthefifthgenerationoftheIntelCoreprocessor.ItisIntel'scodenameforthe14nanometerdieshrinkofitsHaswell ...,5thGenerationCorei7Processors;Broadwell,i7-5557U,2,4,3.10GHz;Broadwell,i7-5600U,2,4,2.60GHz ...,Theseprocessorsareengineeredtodr...

List of Intel Core processors

2.7 Core i (5th gen). 2.7.1 Broadwell-U; 2.7.2 Broadwell-H. 2.8 Core M (5th gen). 2.8.1 Broadwell-Y. 2.9 Core i (6th gen). 2.9.1 Skylake-U; 2.9.2 Skylake-H.

Broadwell (microarchitecture)

Broadwell (previously Rockwell) is the fifth generation of the Intel Core processor. It is Intel's codename for the 14 nanometer die shrink of its Haswell ...

5th Generation Core i7

5th Generation Core i7 Processors ; Broadwell, i7-5557U, 2, 4, 3.10 GHz ; Broadwell, i7-5600U, 2, 4, 2.60 GHz ...

5th Generation Intel® Core™ Processors

These processors are engineered to drive high capability and value into IoT usage models by enabling high-quality user experiences with devices that are small, ...

Broadwell UY

The 5th generation Intel® Core™ processor (U-processor line) is engineered to drive high capability and value into IoT usage models by enabling high-quality ...

第5 代Intel® Core™ 處理器產品規格更新

Intel 技術可能需要搭配支援的硬體、軟體或服務啟動。// 沒有產品或元件能提供絕對的安全性。// 您的成本和成果可能有所落差。// 效能因使用情形、配置和其他因素而異。// ...

第5 代Intel® Core™ 處理器家族,第1 冊(全2 冊):資料表

5th Generation Intel® Core™ Processors Based on the Mobile U-Processor Line ... Find processor configuration, host device configuration, and memory configuration ...

支援第5 代Intel® Core™ i5處理器

尋找第5 代Intel® Core™ i5 處理器的支援資訊,包括精選內容、下載、規格、保固等。

第5 代Intel® Core™處理器家族,第2 冊(全2 冊):資料表

納入收藏:. 5th Generation Intel® Core™ Processors Based on the Mobile U-Processor Line (Broadwell U/Y) ; ID 330835 ; 日期 2015-01-01 ; 格式: ...

Intel 5th Generation 14nm Processors

Intel 5th Generation Core™ Processors are designed to deliver significantly enhanced graphics and increased performance in a smaller thermal envelope.